The invention provides a heat dissipation module used for the heat dissipation of electronic elements. The heat dissipation module comprises a first group of cooling fins which consists of a plurality of the cooling fins mutually arranged at intervals. A plurality of air channels are formed among the cooling fins, and the two sides of the first group of the cooling fins, which are communicated with the air channel, are respectively provided with a first fan and a second fan. The first fan is inclined relatively to the second fan and all airflow orifices face the electronic elements. The airflow generated by the first fan flows through the first group of the cooling fins and blows to the direction of the electronic elements. The second fan extracts the airflow from the electronic elements and then the airflow is discharged by the first group of the cooling fins. The airflow generated by the heat dissipation module of the invention can directly blow to a high-temperature zone nearby theelectronic elements so as to ensure the complete airflow heat dissipation, thus improving the cooling efficiency.