The invention relates to a manufacturing method of a silicon chip grinding carrier, the whole manufacturing process of which is completed by plate cutting, leveling, punching shear, heat treatment, heat preservation and cooling, inspection and putting the carrier in storage. The manufacturing method of the invention is characterized in that the leveling adopts reverse rolling process; in the punching shear of gears, monolithic, rotational positioning and segmented punching shear methods are adopted to punching-shear the gears; when heat treatment is carried out to blanks, a plurality of the blanks are formed into an integral component beforehand and then heat treatment is carried out. Compared with the prior art, the method realizes a full set of carrier manufacturing method with the localization of materials, the standardization of production and the simplification of operation, thus greatly lowering the production cost and solving the technical problems that are be solved for a longtime by the domestic and overseas counterparts who are engaged in the manufacture of the carrier. By adopting the manufacturing method of the invention to manufacture the carrier, not only homemade rolled hard strip steel can be selected as material, thus with no need of depending on import, but also advantages such as small accumulative error, good parallelism, proper warp degree and the stability of tolerance and low technical requirements for operation can be ensured, and carrier processing is not restricted by diameter, thus facilitating localized and standardized production.