The invention relates to a polyimide resin component which is reformed by heat convertible resin, which comprises (a) polyimide resin, (b) cyanate, (c) bismaleimide and (d) nano bulking agent. The problem that thermal-expansion coefficient of thermoplastic polyimide is too high can be solved according to the polyimide resin component which is reformed by heat convertible resin, heat stability canbe increased through improving heat resistance, and the polyimide resin component can be used to produce printing circuit boards through applying with copper foil in low temperature.