The invention relates to a novel alkalescent chemical silver plating solution, which comprises silver ions or silver complex ions of 0.01 to 20g/L, amine complex agent of 0.1 to 150g/L, amino acid complex agent of 0.1 to 150g/L, and polyhydroxy complex agent of 0.1 to 150g/L. The alkalescent chemical silver plating solution provided by the invention can overcome the shortcomings of the cooper wire etching, the side corrosion, a prior acid chemical silver technique popular both at home and abroad, the blind pore silver plating difficulty, the solderhead voids and the low soldering intensity with a prior acid chemical silver technique popular both at home and abroad. A silver layer plated by the silver plating solution is characterized by the high corrosion-resistance, the low contact electric resistance, no electromigration, the high soldering intensity, and the high wire bonding intensity. Moreover, no bubbles are caused to the soldering materials when the plating part is soldered.