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发明授权
CN101180417B 溅射装置及成膜方法 有权

溅射装置及成膜方法
摘要：
本发明提供一种靶的使用效率高的溅射装置。本发明的溅射装置(1)具有移动部件(28a、28b)，移动部件(28a、28b)可使第一、第二磁铁部件(23a、23b)在与第一、第二靶(21a、21b)的表面平行的面内移动。如果第一、第二磁铁部件(23a、23b)移动，则磁力线也移动，第一、第二靶(21a、21b)表面的高侵蚀区域也移动，因此第一、第二靶(21a、21b)表面的广泛区域可被溅射。
摘要（英）：

A sputtering apparatus having a high target use efficiency. The sputtering apparatus (1) is provided with moving means (28a, 28b), and first and second magnet members (23a, 23b) are movably constituted within a plane parallel to the surfaces of first and second targets (21a, 21b) by moving means (28a, 28b). When the first and the second magnet members (23a, 23b) move, magnetic field lines and high erosion areas on the surfaces of the first and the second targets (21a, 21b) also move. Therefore, large areas on the surfaces of the first and the second targets (21a, 21b) are sputtered.

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