To provide is an electroconductive joining material which exhibits high storage stability and, when desired, can be cured, preferably rapidly at a low temperature. In one invention, an electroconductive joining material contains an electroconductive particle component, an epoxy resin component and an epoxy resin curing component and is characterized in that the epoxy resin curing component further includes a modifier having a thiol group. In another invention, an electroconductive joining material is characterized in that the epoxy resin curing component thereof contains a sulfur-containing compound having a terminal group coordinating to the surface of a metal particle, and the sulfur-containing compound acts as a curing agent of an epoxy resin by elimination of the terminal group from the surface of a metal particle. The electroconductive joining material may further contain a fragrant component.