知搜-全球专利检索

  1. 登录
  2. 注册
发明授权
CN101142052B 激光加工装置、程序生成装置以及激光加工方法 有权

激光加工装置、程序生成装置以及激光加工方法
摘要：
一种激光加工装置，其以多次重复以下循环的加工模式，对被加工物进行多个打孔加工，该循环是，一边使激光的照射位置变化，一边对前述被加工物的多个加工位置每次照射1至几次激光，其具有：照射位置移动部，其使由激光振荡部激励出的激光向被加工物的照射位置移动；以及控制部，其控制激光振荡部激励出的激光的激励定时以及照射位置移动部移动的激光照射位置，控制部控制照射位置移动部，以使得在第一个循环中，向第1孔照射激光时，照射位置移动部使其向第1孔的打孔加工位置移动的照射位置的移动路径，与在第2个及之后的循环中，向第1孔照射激光时，照射位置移动部使其向第1孔的打孔加工位置移动的照射位置的移动路径为同一路径。
摘要（英）：

A laser machining device does a plurality of perforating machining to the machining with multiple repeating the machining mode of the following circulation, the circulation is changing the irradiating the position of laser and at the same time each irradiating one to a plurality of times of laser to a plurality of machining position of the machining object, and the device comprises the following components: an irradiating position moving part which moves the laser excited from the laser oscillation part to the irradiation position of the machining object; and a control part which controls theexciting timing of the laser excited from the laser oscillation part and the irradiation position of the laser moved by the irradiation position moving part, the control part controls the irradiationposition moving part in order that the irradiation position moving part leads to the moving path of the irradiation position moving to the perforating machining position of the first hole when laser is irradiated in the first circulation, the second circulation and the following circulations to be an identical path.

公开/授权文献
0/0