The invention relates to a method and device for Ball Array of the soldered ball in BGA Ball Grid Array Package technology, which belongs to technical field of electronic packing. The invention is toinject the inert gases into the crucible and the vacuum gas tight chamber and makes the crucible and the vacuum gas tight chamber achieve the stable differential pressure by pressure control system, and makes the metal melt ejected from a tiny nozzle of the crucible in the form of laminar jet. The vibration generated from piezoelectric oscillator perturbates the metal jet and makes it fracturedinto the even liquid drop, and then obtains the real-time size parameters aided by the monitoring system and computer analysis to feedback control the frequency of the oscillator and reduce the difference in size between the generated molten drop and the preset molten drop. The invention can correctly place the even solder ball in the appropriate thermodynamic state on the substrate preconfiguredwith the positions of the solder ball, which has the advantages of short process flow, good quality of product and greatly lowering the equipment investment.