The present invention relates to a novel dip forming method of a specific dry-type capacitor. An isolation screen is added. A core group, which dips the dipping material from bottom to upside, is adopted, and a glass rod is used in a diversion step. The core group is thoroughly solidified by the heat preservation of a multi-temperature zone. The purpose of the present invention is to solve the problems of dipping and an encapsulation of the specific capacitors and the relevant electronic equipments. With a strong technical generality, less implementation difficulty, little investment and stable and reliable quality, the dip forming can satisfy the requirements of the electronic equipment of miniaturization, dry-type (solidification), large span of working temperature-zones and strong environmental applicability. The present invention can be used for manufacturing specific capacitors which are applied to high current with high temperature and high voltage, such as a filter capacitor which is used for high-voltage electrical source of airplane, an engine-igniting capacitor, a deep-well pulse sound wave exploration etc. The present invention can also be used in the encapsulation field of high-performance electronic equipment.