A solder paste which comprises a flux or a thermosetting resin and, dispersed therein, a first metal powder being composed of a first metal material, such as Cu, Ag, Au and Pd, as a base material anda second metal material, such as Sn and In, having a melting point lower than that of the fist metal material and being attached to the surface of the first metal material, a second metal powder beingcomposed of a metal material, such as Sn or In, having a melting point lower than that of the fist metal material, and a third metal powder, such as Cu, Ag, Au and Pd, having an average particle diameter less than that of the first metal material and being capable of combining with the second metal material and the second metal powder. The use of the above solder paste allows the suppression of the retention of an unreacted component after a heating treatment, which results in the avoidance of the lowering of the joining strength of a solder joint, even after repeated reflow treatments.