The invention provides an application of epoxide resin-aluminium nitride compound material in the production for high density print circuit board. The method of producing the epoxide resin-aluminium nitride compound material is: pretreating the aluminium nitride nano or micro grain surface by coupling agent; adding the solvent into the aluminium nitride grain, then agitating the produced solution by the hyperacoustic agitator; mixing the aluminium nitride solution and epoxide resin system uniformly, becoming uniform dispersion; injecting the dispersion into die, then drying and solidifying in vacuum. In which, the grain diameter of the aluminium nitride grain is 10nm to 50nm. The weight of the aluminium nitride grain is 5-70wt% of the compound material gross weight.