The inventive process and special apparatus for preparing sampling prick by electric plating belong to the field of scientific apparatus. The process is that, stainless steel sampling prick is placed in the electroplate liquid as cathode and nickel is placed in it as anode; the electroplate liquid comprises nickel sulfate, sodium chloride, boric acid; current density is 2-3 amp./dm<2> at electric plating; power supply is turned off after nickel electric plating layer rech the thickness of sampling prick, boring on top of sampling prick mould by lathe, and removing the end plating layer on the bottom of sampling prick mould, separating the prepared sampling prick and the mould. The apparatus includes special cathode 1 and anode 2, heat coil 5 under plating bath 4, temperature-sensing probe 7 in electroplate liquid 3. There is provided with metal pole 9, electric brush 10, insulator 11, which are connected with the rotating shaft of speed regulating motor 12. Ultra thin sampling pric can be produced using the invention with mature process and low cost, the apparatus has the advantages of great function, simple operation, ect., using Single-chip Microcomputer controlled system.