知搜-全球专利检索

  1. 登录
  2. 注册
发明授权
CN101031518B 用于半导体包封的玻璃和用于半导体包封的外管以及半导体电子部件 有权

用于半导体包封的玻璃和用于半导体包封的外管以及半导体电子部件
摘要：
本发明的目的是提供一种环保的、半导体包封用的玻璃和用于半导体包封的外管，以及允许半导体电子部件具有700℃或更高的耐热性作为普通最高温度，以及提供一种半导体电子部件。根据本发明的半导体包封用的玻璃基本上不包含铅和粘滞度达到1010dPa·s时的温度是700℃或更高。根据这种结构，由于玻璃基本上不包含铅，在半导体包封用的外管的制造中和在半导体电子部件的制造中，不会排出有害成分，因此该玻璃是环保的。而且，由于粘滞度达到1010dPa·s时的温度是700℃或更高，使用该玻璃的半导体电子部件如珠形热敏电阻具有700℃或更高的耐热性作为普通最高温度。
摘要（英）：

An object of the invention is to provide glass for semiconductor encapsulation and an outer tube for semiconductor encapsulation which are friendly to environment and allow semiconductor electronic parts to have a heat resistance of 700 DEG C or higher as normal maximum temperature, and semiconductor electronic parts. The glass for semiconductor encapsulation according to the invention contains essentially no lead and the temperature at which viscosity reaches 10<10>dPas is 700 DEG C or higher. According to such a constitution, since the glass contains essentially no lead, no harmful ingredients are discharged in the production of the outer tube for semiconductor encapsulation and in the production of the semiconductor electronic parts and thus the glass is friendly to environment. Moreover, since the temperature at which viscosity reaches 10<10>dPas is 700 DEG C or higher, semiconductor electronic parts such as a bead thermistor using the same has a heat resistance of 700 DEG C or higher as normal maximum temperature.

公开/授权文献
0/0