Embodiments of the invention are generally directed to systems, methods, and apparatuses for thermal management using an on-die thermal sensor. In some embodiments, an integrated circuit (e.g., a memory controller) includes temperature collection logic and control logic. The temperature collection logic receives and stores temperature data from a plurality of remote memory devices each having an on-die thermal sensor. In some embodiments, the control logic controls a thermal throttle based, at least in part, on the temperature data. Other embodiments are described and claimed.