In a method of forming by drawing a wiring pattern on a board by drip feeding a liquid solution including an electrically conductive constituent, there is used, for the board, a board with elemental oxygen included in a surface of the board, the surface having a critical surface tension at 25 DEG C. of less than 25 dyn/cm, and for the liquid solution, there is used a liquid solution having a surface tension which is greater than the aforementioned critical surface tension. With the method, it is possible to combine drawability and adherence.