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发明授权
CN100593364C 电子器件及其制造方法 失效 - 权利终止

电子器件及其制造方法
摘要：
一种制造电子器件的方法包括：对由树脂制成的膜的下方表面进行粗糙化，所述下方表面与膜中用于安装电路芯片的安装表面相反；在膜的安装表面上形成导体图案，从而获得由膜制成的基体，其上形成电路图案；将热固性粘合剂涂覆到基体中形成有导体图案的表面。该方法还包括：通过热固性粘合剂把要连接到导体图案的电路芯片安装在基体上；用具有施压器部分和支撑部分的加热设备夹住基体，所述施压器部分毗邻安装在基体上的电路芯片，所述支撑部分毗邻经过粗糙化的膜的下方表面；用加热设备对热固性粘合剂进行加热并使之硬化来将电路芯片固定到导体图案。
摘要（英）：

A method of manufacturing an electronic device includes: roughening an underside surface of a film made of a resin, opposite to a mounting surface of the film for mounting a circuit chip; forming a conductor pattern on the mounting surface of the film, thereby obtaining a substrate made of the film where the conductor pattern is formed; and attaching a thermoset adhesive to a conductor-pattern-formed surface of the substrate. The method further includes: mounting the circuit chip to be connected to the conductor pattern on the substrate via the thermoset adhesive; clamping the substrate by a heating apparatus having a presser section and a support section, the presser section abutting the circuit chip mounted on the substrate and the support section abutting the underside surface of the roughened film; and fixing the circuit chip to the conductor pattern by heating and hardening the thermoset adhesive using the heating apparatus.

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