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发明授权
CN100592538C 高亮度白色光发光二极管的封装方法 有权 转让 许可

高亮度白色光发光二极管的封装方法
摘要：
一种高亮度白色光发光二极管的封装方法，主要包括发光二极管芯片、散热基板、荧光粉胶膜，其特征在于所述在基板上焊接有发光二极管芯片，涂有脱模剂的模具加压定位于散热基板之上，然后把含有荧光粉的封装胶注入模具中，并抽取真空，待固化后脱模，在发光二极管芯片的上表面和侧面形成厚度均匀的含荧光粉的胶膜。本发明的优点是在发光二极管芯片的外表面形成一厚度均匀的荧光粉胶膜，提高了发光二极管芯片的发光均匀性和一致性，提高了封装的生产效率。
摘要（英）：

A packaging method for high-brightness light-emitting diode of white light mainly comprises a light-emitting diode chip, a radiating substrate and a phosphor glue film. The invention is characterizedin that the light-emitting diode chip is welded on the substrate, a mould coated with the mould release is positioned on the radiating substrate by pressurizing, the package resin containing phosphoris poured into the mould, then glue film with uniform thickness and containing phosphor is formed on the upper surface and lateral surface of the light-emitting diode chip after evacuation, solidification and mold release. The invention has the advantages that a glue film containing phosphor with uniform thickness formed on the external surface of the light-emitting diode chip promotes the uniformity and consistency of luminescence from the light-emitting diode chip, and promotes the production efficiency of packaging.

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