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发明授权
CN100517700C 影像感应器封装结构 有权

影像感应器封装结构
摘要：
一种影像感应器的封装结构，包括基板、透镜模块及底盖。其中，此基板具有上表面及下表面，且下表面制作有数个无源组件，并在上表面设置有一芯片，接着将透镜模块套合于基板上且包覆芯片，然后将底盖连接于基板的下表面且包覆无源组件。
摘要（英）：

A package structure of an image sensor includes a base board, a lens module and a bottom cover, in which, the base board has an upper surface and a lower surface set with several passive components, a chip is set on the upper surface, then the lens module is sleeved on the base board and covers the chip and the bottom cover is connected to the lower surface and covers the passive component.

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